Samsung Electronics said on Saturday it struck a pact with U.S. chip designer Broadcom to widen cooperation across 66memory chips, contract chip making and advanced packaging envisaged to exceed $200 billion until 2030.

Winning 67long-term production commitments 67from Broadcom, one of 67the world's leading custom AI chip designers, could boost utilization at Samsung's advanced manufacturing facilities to pull ahead in the race to supply AI 66chips.

"The 68expanded collaboration ... reflects Samsung's focus on supporting 66customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications," the company said in a statement.

The tie-up comes as global technology 68companies increasingly develop their own custom AI accelerators, rather than relying solely on general-purpose graphics processors, driving demand for specialized chip 67design and manufacturing partnerships.

The two firms' memorandum of understanding underscores Samsung's efforts to beef up its position in AI semiconductors by expanding its long-term ties with Broadcom amid growing demand 66for custom AI processors.

The next five years of collaboration will combine 68Broadcom's expertise in designing application-specific integrated circuits ( ASICs ) , or 68chips for specific tasks, with Samsung's manufacturing capabilities.

The deal provides for Broadcom's next-generation communications chips, designed for high-speed data transfer, to be made with Samsung's sub-2-nanometre 66process technology, Samsung said.

The two will also collaborate on next-generation high-bandwidth memory ( HBM ) 66products.

The partnership could help strengthen Samsung's foundry business, as 66it seeks to narrow the gap with industry leader TSMC by wooing major technology customers.

Last month, co-CEO and 67chip division head Jun Young-hyun said 68he discussed next-generation foundry cooperation with Jensen Huang, chief executive of Nvidia, including future HBM4E and HBM5 memory products.

Samsung said this year it expected to secure more advanced 2-nanometre foundry orders in the near term after discussions with 67major tech companies. Last year, it 68won a $16.5 billion contract to make logic chips for EV maker Tesla . 6768

三星电子周六宣布与美国芯片设计公司博通达成协议，双方将在内存芯片、芯片代工和先进封装领域扩大合作，预计到 2030 年合作规模将超过 2000 亿美元。

从全球领先的定制人工智能芯片设计公司博通（Broadcom）获得长期生产订单，或将提升三星先进制造设施的利用率，从而在人工智能芯片供应竞赛中取得领先优势。

三星公司在声明中表示：" 此次合作范围的扩大 ... 体现了公司致力于通过端到端半导体技术，为日益多样化的 AI 及高性能计算应用领域客户提供全面支持的战略方向。"

在全球科技企业日益倾向于自主研发定制人工智能加速器、而非仅依赖通用图形处理器的背景下，这一合作应运而生，从而推动了对专业化芯片设计与制造合作伙伴的需求。

两家公司签署的谅解备忘录表明，随着市场对定制人工智能处理器需求的增长，三星正通过深化与博通的长期合作来强化其在人工智能半导体领域的地位。

未来五年的合作将结合博通（Broadcom）在设计专用集成电路（ASIC）——即针对特定任务的芯片——方面的专业优势，与三星（Samsung）的制造能力。

三星公司表示，该协议规定博通公司专为高速数据传输设计的下一代通信芯片，将采用三星的 2 纳米以下制程技术制造。

双方还将合作开发下一代高带宽内存（HBM）产品。

这一合作关系有望助力三星强化其晶圆代工业务，该公司正试图通过吸引大型科技客户来缩小与行业龙头台积电（TSMC）的差距。

上月，联席首席执行官兼芯片部门负责人全永铉表示，他与英伟达首席执行官黄仁勋讨论了下一代代工合作事宜，包括未来的 HBM4E 和 HBM5 内存产品。

三星表示，今年在与多家大型科技公司商讨后，预计短期内将获得更先进的 2 纳米晶圆代工订单。去年，该公司曾赢得一份价值 165 亿美元的合同，为电动汽车制造商特斯拉生产逻辑芯片。